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Quiz 2025 Supermicro SDLCSA: Marvelous Supermicro Direct Liquid Cooling Service Associate (SDLCSA) Exam Reliable Test Book

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Supermicro Direct Liquid Cooling Service Associate (SDLCSA) Exam Sample Questions (Q11-Q16):

NEW QUESTION # 11
Which type of Liquid Cooling is discussed in this training?

A. Direct to Chip (DLC)
B. Evaporative Cooling
C. Immersion Cooling (ILC)
D. Rear Door Heat Exchanger (RDHx)

Answer: A

Explanation:
The training focuses on Supermicro'sDirect to Chip (DLC)liquid cooling, as indicated by the context of SYS-
421GE-TNHR2-LCC and Supermicro's expertise in DLC solutions (e.g., cold plates, CDUs up to 100kW).
DLC circulates coolant directly to CPUs/GPUs, reducing OPEX by 40% and supporting high-density racks. A (RDHx) cools via rear doors, B (Evaporative) uses evaporation, and C (ILC) submerges servers-none match Supermicro's DLC emphasis here. D is the verified type.References:Supermicro DLC whitepapers, SYS-
421GE-TNHR2-LCC cooling specs.

NEW QUESTION # 12
The single screw that secures the BMC card is shorter than the 2 screws securing the BMC cable to the PCIe tray. True or False.

A. True
B. False

Answer: A

Explanation:
In Supermicro systems, the BMC (Baseboard Management Controller) card is secured with asingle, shorter screwto its bracket, while the BMC cable uses2 longer screwsfor robust attachment to the PCIe tray, per standard designs (e.g., SYS-420GP-TNAR). This difference accommodates component size and mounting depth in DLC setups. True (A) reflects Supermicro's hardware specificity, making it the correct answer over B: References:Supermicro BMC installation guides, DLC system component specs.

NEW QUESTION # 13
What must be removed first, in order to remove the BMC cable and IO Module from the PCIe tray?

A. The BMC cage
B. The AOM cage
C. The PCIe tray
D. The AOC cage

Answer: D

Explanation:
The BMC (Baseboard Management Controller) cable and IO Module in Supermicro systems like the SYS-
421GE-TNHR2-LCC are often tied to add-on cards (AOC) within the PCIe tray. The AOC cage (likely an Add-On Card cage) must be removed first to access these components, as it houses cards and cables interfacing with the BMC. Supermicro's design (e.g., SYS-420 series) places AOC cages as sub-assemblies within the PCIe tray, requiring removal before deeper access. A (AOM cage) may be a typo or misidentification, B (BMC cage) isn't standard terminology here, and C (PCIe tray) is too broad since it's the parent assembly. D fits Supermicro's DLC service hierarchy, making it correct.
References: Supermicro PCIe tray sub-assembly guides, DLC system component access.

NEW QUESTION # 14
What are the full steps and proper order for replacing a failed NVMe SSD drive in the SYS-421GE-TNHR2- LCC system?

A. Remove failed drive/drive carrier from chassis carriage > Remove failed drive from drive carrier > Insert new drive into drive carrier > Insert new drive/drive carrier into chassis carriage
B. Remove failed drive/drive carrier from chassis carriage > Insert new drive/drive carrier into chassis carriage > Remove failed DIMM from drive carrier > Insert new drive into drive carrier
C. Remove failed drive/drive carrier from chassis carriage > Remove failed drive from drive carrier > Insert new drive/drive carrier into chassis carriage > Insert new fan into drive carrier
D. Remove failed drive from drive carrier > Remove CPU from chassis carriage > Insert new drive into drive carrier > Insert new drive/drive carrier into chassis carriage

Answer: A

Explanation:
Replacing an NVMe SSD in a Supermicro system like the SYS-421GE-TNHR2-LCC, which supports Direct Liquid Cooling, follows a standard procedure for hot-swappable drives in high-performance servers. The correct sequence, as outlined in Supermicro's general server maintenance guides (e.g., for SYS-420 series or similar DLC-enabled systems), is:
* Remove failed drive/drive carrier from chassis carriage: NVMe drives are housed in carriers for easy access and hot-swap capability, a feature emphasized in Supermicro's DLC rack-scale solutions for minimizing downtime in AI/HPC workloads.
* Remove failed drive from drive carrier: The carrier is opened to extract the faulty NVMe SSD.
* Insert new drive into drive carrier: The replacement NVMe SSD is secured into the carrier.
* Insert new drive/drive carrier into chassis carriage: The carrier is reinserted into the chassis, ensuring proper connection.Option D accurately reflects this logical order. Option A incorrectly involves DIMMs (memory modules), B mentions a fan (unrelated to NVMe replacement), and C involves a CPU (not part of the process). Supermicro's DLC systems prioritize modularity and serviceability, making D the verified procedure.References:Supermicro NVMe SSD replacement guides (e.g., SYS-420GP-TNAR Manual), DLC solution serviceability features.

NEW QUESTION # 15
How do you know when the DIMM has been properly inserted back into the slot?

A. You shouldn't hear a click after you've pressed the DIMM down into the slot
B. You should hear a click after you've pressed the DIMM down into the slot
C. You should still be able to wiggle the DIMM after you've pressed the DIMM down into the slot
D. You should see a green lit button on the DIMM

Answer: B

Explanation:
When inserting a DIMM in Supermicro systems, proper seating is confirmed by aclickas the slot latches snap into place, securing the module (e.g., SYS-420GP-TNAR manuals). This audible feedback is standard in DLC systems for reliable memory installation. B (green button) isn't a feature, C contradicts correct insertion, and D (wiggling) indicates failure. Supermicro's design ensures firm DIMM placement, making A the verified sign.References:Supermicro DIMM installation guides, DLC system component reliability.

NEW QUESTION # 16
......

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Introduction to Cisco switches and their associated architecture, The SDLCSA translator is divided into two sections: The Text to Translate section at the top of the screen, which has a light green background.

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